Engineering / CAM
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Engineering
- Design Support
- DFM (Class 2 and Class 3)
- Technical Presentations for General PCB Manufacturing or Specific Subject or Application -ITL Engineering Support Staff are available to work directly wtih your NPI or Design Team. We will provide guidance in material selection, fabrication options, impedance model and optimum design practices for effective cost control.
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CAM
- Polar Si8000 Impedance Calculator
- Orbotech/Frontline Genesis 2000 CAM Stations
- ITL Bostomatic CNC Format Conversion Software
- ITL DNC System Management Software
- Highland and Excellon DNC Interfaces
- Infinite Graphics EXT Netlist Extractor
- ATG DPS Flying Probe Programmer
- ECT MagicSuite ET Fixture Design Software
Click Here for Design Guidelines. |
| The following represents general process allowance which take into account economic factors and best industry practices: |
- Conductor Width:
- +.001 for 1/2 oz Copper
- +.002 for 1 oz Copper
- +.004 for 2 oz Copper
- ie: .005" Trace should be etch compensated to .006" for 1/2 oz copper
- Conductor Spacing:
- .005 for 1/2 oz Copper
- .007 for 1 oz Copper
- .010 for 2 oz Copper
- Pad / Land Diameter: (Ref IPC-2221)
- Pmin = a + 2b +c
where
P = Pad
a = Max Hole Diameter
b=Min Annular Ring
c= Process Allowances
- Preferred .016
- Standard .010
- Reduced Producability .008
- Plane Clearance / Anti-Pad:
- Preferred: Drill plus .020 minimum
- Reduced Producibility: Drill plus .016
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- Soldermask:
- Apperture Size =
Copper Feature + .010 Preferred
or
.006 Reduced Producibility
- Adjacent Trace of Plane clearance
-Preferred .010"
- This insures soldermask will cover intended features and provide
sufficent clearance to eliminate the possibility of soldermask going
over solderable areas
- Reduced Producibility .006"
- Minimum Feature / Dam .002
- Silkscreen:
- Minimum Character Height .030
- Minimum Character Thickness .005
- Character to Feature Clearance .010 minimum
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