|
Current
|
Mid-Term
|
Long-Term
|
Technology
|
2010
|
2011-2012
|
2013-2014
|
| Line Width/Space- Phototool |
.0035
|
.003
|
.003
|
| Line Width/Space- Laser Direct Imaging (LDI) |
N/A
|
.002
|
.002
|
| Plated Hole Diameter |
.006
|
.005
|
.004
|
| Pad Diameter |
.016
|
.012
|
.010
|
| Drill Size-Mechanical |
.008
|
.008
|
.006
|
| Drill Size-Laser |
N/A
|
.005
|
.004
|
| Plane Clearance + Drill Size |
.018
|
.016
|
.014
|
| Maximum Aspect Ratio |
10:1
|
11:1
|
12:1
|
| Maximum Number Layers |
20
|
24
|
30
|
| Minimum Core Thickness |
.004
|
.004
|
.003
|
| Maximum Panel Size |
21 x 24
|
21 x 24
|
21 x 24
|
| Maximum Board Thickness |
.175
|
.175
|
.250
|
| BGA Pitch |
0.5 mm
|
0.5 mm
|
0.5 mm
|
| Blind/Buried Via-Mechanical Drill / Sequential |
Yes
|
Yes
|
Yes
|
| Via Filling and Planarization - Cap Plating (IPC-4761) |
Yes
|
Yes
|
Yes
|
| Micro-Via-Laser Drill to Capture Pad |
N/A
|
Yes
|
Yes
|
|
|
|
Current
|
Mid-Term
|
Long-Term
|
Tolerance
|
2010
|
2011-2012
|
2013-2014
|
| Layer-to-Layer Registration |
+/- .005
|
+/- .005
|
+/- .004
|
| Warpage |
.70%
|
.50%
|
.50%
|
| Board Thickness |
+/- 10%
|
+/- 10%
|
+/- 8%
|
| Trace Width (Half Ounce Copper) |
+/- .001
|
+/- .0007
|
+/- .0005
|
| Impedance |
+/- 10%
|
+/- 10%
|
+/- 7%
|
| Hole Location |
+/- .003
|
+/- .003
|
+/- .002
|
|
|
|
Current
|
Mid-Term
|
Long-Term
|
Standard Materials
|
2010
|
2011-2012
|
2013-2014
|
| FR-4 140-150 Tg / High Temp 170 Tg |
Yes
|
Yes
|
Yes
|
| RoHS / Lead-Free ISOLA IS-410/PCL370 |
Yes
|
Yes
|
Yes
|
| Polyimide 260 Tg |
Yes
|
Yes
|
Yes
|
| BT Epoxy |
Yes
|
Yes
|
Yes
|
|
|
|
Current
|
Mid-Term
|
Long-Term
|
High Frequency Materials
|
2010
|
2011-2012
|
2013-2014
|
| Isola FR-408/IS415/IS620 |
Yes
|
Yes
|
Yes
|
| Nelco N4000-13 |
Yes
|
Yes
|
Yes
|
| Rogers 4000 series |
Yes
|
Yes
|
Yes
|
| Arlon 25 series |
Yes
|
Yes
|
Yes
|
| Teflon (Various suppliers) |
Yes
|
Yes
|
Yes
|
|
|
|
Current
|
Mid-Term
|
Long-Term
|
HDI Materials
|
2010
|
2011-2012
|
2013-2014
|
| RCC (Resin Coated Copper Foil) |
No
|
Yes
|
Yes
|
| Other: Lead-Free, CAF, Halogen-Free |
Yes
|
Yes
|
Yes
|
|
|
|
Current
|
Mid-Term
|
Long-Term
|
Surface Finishes (Thickness)
|
2010
|
2011-2012
|
2013-2014
|
| Immersion Gold ( RoHS/Lead-Free) |
3-5 u inch
|
3-5 u inch
|
3-5 u inch
|
| Immersion Tin ( RoHS/Lead-Free) |
30-60 u inch
|
30-60 u inch
|
30-60 u inch
|
| Immersion Silver ( RoHS/Lead-Free) |
8-14 u inch
|
8-14 u inch
|
8-14 u inch
|
| Lead Free HASL ( RoHS/Lead-Free) |
.0001 - .0015
|
.0001 - .00015
|
N/A
|
| Hot-Air-Solder-Level (HASL) |
.0001 - .0015
|
.0001 - .0015
|
N/A
|
| Electrolytic Soft Gold |
30 u inch
|
30 u inch
|
30 u inch
|
| Electrolytic Hard Gold |
50 u inch
|
50 u inch
|
50 u inch
|
| Selective Solder Strip |
.0003 - .0008
|
.0003 - .0008
|
N/A
|
| Gold Tabs |
30-50 u inch
|
30-50 u inch
|
30-50 u inch
|
|
|
|
Current
|
Mid-Term
|
Long-Term
|
Soldermask
|
2010
|
2011-2012
|
2013-2014
|
| Minimum Web (Dam) |
.002
|
.002
|
.002
|
| Via Plug - Secondary Screen |
Yes
|
Yes
|
Yes
|
|
|
|
Current
|
Mid-Term
|
Long-Term
|
Electrical Test
|
2010
|
2011-2012
|
2013-2014
|
| Universal Grid- SMT Dual Sided |
.015 Pitch
|
.015 Pitch
|
.012 Pitch
|
| Flying Probe |
.006 Pitch
|
.006 Pitch
|
.004 Pitch
|
| Non-Contact Tester |
N/A
|
N/A
|
Yes
|
|
|
|
Current
|
Mid-Term
|
Long-Term
|
HDI
|
2010
|
2011-2012
|
2013-2014
|
| Sequential Lamination- Mechanical Drill |
.008
|
.008
|
.006
|
| Laser Ablation- Drill Diameter |
N/A
|
.005
|
.004
|
| Laser Ablation- Capture Pad Diameter |
N/A
|
.012
|
.010
|