|
|
Current
|
Mid-Term
|
Long-Term
|
|
Technology
|
2008
|
2009-2010
|
2011-2012
|
|
Line Width/Space- Phototool
|
.0035
|
.003
|
.003
|
|
Line Width/Space-
Laser Direct Imaging (LDI)
|
N/A
|
.002
|
.002
|
|
Plated Hole Diameter
|
.006
|
.005
|
.004
|
|
Pad Diameter
|
.016
|
.012
|
.010
|
|
Drill Size-Mechanical
|
.008
|
.008
|
.006
|
|
Drill Size-Laser
|
N/A
|
.005
|
.004
|
|
Plane Clearance + Drill Size
|
.018
|
.016
|
.014
|
|
Maximum Aspects Ratio
|
8:1
|
10:1
|
12:1
|
|
Maximum Number Layers
|
20
|
24
|
30
|
|
Minimum Core Thickness
|
.004
|
.004
|
.003
|
|
Maximum Panel Size
|
21 x 24
|
21 x 24
|
21 x 24
|
|
Maximum Board Thickness
|
.175
|
.175
|
.250
|
|
BGA Pitch
|
.08 mm
|
0.5 mm
|
0.5 mm
|
|
Blind/Buried Via- Mechanical Drill / Sequential
|
Yes
|
Yes
|
Yes
|
|
Micro-via- Laser
Drill to Capture Pad
|
N/A
|
Yes
|
Yes
|
